As GPU power consumption breaks the kilowatt barrier, chip heat dissipation has become the core bottleneck restricting AI computing power. Ceramic substrates, with their outstanding heat dissipation performance, stable dielectric properties, and high reliability, perfectly align with AI's core demands for thermal management, high-frequency high-speed operation, and stability.

Take AlN ceramic substrates as an example. Their thermal conductivity can reach 170-230 W/(m·K), 6-10 times that of alumina substrates. With a thermal expansion coefficient of approximately 4-5 ppm/℃, AlN matches silicon chips closely, effectively preventing solder joint failures caused by excessive temperature differences. In applications such as LED heat dissipation AlN substrates, chip junction temperatures can be controlled within reasonable ranges, significantly improving heat dissipation efficiency.

Without high-performance ceramic substrates, AI chips running at full speed are essentially "running a fever."

Market Explosion: How Big Is the Opportunity?

According to Global Info Research, global ceramic substrate revenue reached approximately USD 1.617 billion in 2024 and is projected to climb to USD 4.144 billion by 2031, representing a CAGR of 14.6%.

Market Research Future estimates the ceramic substrate market at USD 12.79 billion in 2024, with growth from USD 14.51 billion in 2025 to USD 51.21 billion by 2035, averaging 13.44% annual growth.

AlN and silicon nitride substrates are growing significantly faster than traditional alumina products, primarily because alumina ceramics increasingly fail to meet the thermal management requirements of power modules in high-power packaging applications.

Industry Chain Key: Powder Determines Substrate Performance

The performance ceiling of ceramic substrates largely depends on upstream powder materials. Currently, high-end AlN powder preparation technology is basically monopolized by Japan, the United States, and Germany, accounting for the majority of global market share.

China started AlN powder preparation relatively late, but has made significant progress in recent years. Xiamen Juci Technology Co., Ltd. is a representative enterprise.

Founded in 2016 in Xiamen based on the research achievements of Professor Qin Mingli's team at the University of Science and Technology Beijing, Juci focuses on the R&D, production, and sales of high-grade AlN powder and ceramic products. The company's main products include four categories: high-purity fine AlN powder, AlN granulation powder, AlN filler powder, and AlN ceramic products.

In 2023, Juci was selected as a "National Specialized and Innovative Little Giant Enterprise," with AlN production reaching 400 tons. In 2024, the company's AlN powder capacity reached 600 tons, ranking among the world's leading players in terms of capacity and sales scale. The company adopts the precursor carbothermal reduction nitridation method, and its product quality has been widely recognized by domestic and international customers.

In September 2024, Juci signed an agreement with the Hohhot Economic and Technological Development Zone to invest RMB 800 million in building an Inner Mongolia production base for high-purity nitride electronic ceramic materials. Upon full operation, the project will produce 5,000 tons of high-purity nitride electronic ceramic materials annually. As the project gradually progresses, the company's annual capacity will increase substantially, with the potential to rank among the global leaders in this niche segment. The project leverages local advantages in land and electricity costs, further enhancing the company's core competitiveness.

Notably, Juci holds a leading position in injection-molded complex precision AlN ceramic products, capable of producing precision ceramic components for high-end applications such as IGBT packaging, power modules, and LED heat dissipation AlN substrates.

Juci Product Matrix and Core Advantages

With thermal conductivity reaching 170-230 W/(m·K)—far exceeding alumina substrates (15-30 W/(m·K))—AlN ceramic substrates are the ideal choice for high-power device packaging. Juci's product line covers key segments of the AlN industry chain:

Powder Products: Including high purity AlN powder, low oxygen content AlN powder, and semiconductor grade AlN powder, meeting diverse application requirements. High purity AlN powder price is competitive, providing downstream customers with cost-effective domestic alternatives.

Ceramic Products: Complex precision AlN ceramic components widely used in power module packaging, LED heat dissipation AlN substrates, and AlN ceramic substrate sintering applications.

AlN Thermal Materials: As the core raw material for AlN thermal materials, Juci's AlN powder has broad application prospects in thermal interface materials (TIM) such as thermal greases, thermal gels, and thermal pads.

The Future Is Here: Domestic Substitution at the Right Time

With the accelerated penetration of third-generation semiconductors—silicon carbide and gallium nitride—and the explosive demand for AI computing power, ceramic substrates are facing a historic opportunity.

Domestic enterprises have achieved the transition from "following" to "running alongside" in the AlN powder field. The rise of companies like Juci is breaking the monopoly of international giants on high-end powder materials, providing stable and reliable domestic raw material supply for downstream AlN ceramic substrate manufacturers. As the Inner Mongolia 5,000-ton capacity project gradually advances, Juci Technology's leading position in the global AlN materials field will be further consolidated.

From "flour" to "bread," the domestic ceramic substrate industry chain is accelerating its closed loop. Whoever masters the core preparation technology of high thermal conductivity AlN powder at the material end will gain the upper hand in the heat dissipation competition of the AI computing era.

Xiamen Juci specializes in the R&D, production, and sales of AlN powder and AlN ceramic structural components, possessing mature production technologies and a comprehensive service system with reliable quality and stable supply. For those in need of AlN powder and related products, please feel free to contact us at any time, and we will provide you with professional solutions.

Contact: Jenny Qin / 진현혜

Xiamen Juci Technology Co., Ltd.

Phone: +86 151-5177-8700

Email: qinxianhui@chinajuci.com

Website: www.jucialnglobal.com

Aluminum Nitride (AlN) powder features high thermal conductivity (320 W/(m·K) theoretical) and a thermal expansion coefficient matching silicon, making it ideal for ceramic substrates in semiconductor power devices, IGBT modules, and high-power LEDs. With thermal conductivity 6-10× higher than alumina, AlN is replacing alumina in 5G communications, new energy vehicles, and photovoltaic inverters. Buyers seeking cost-effective AlN powder or high-purity AlN powder should carefully select a reliable AlN manufacturer.

I. AlN Powder Preparation

High-purity AlN powder is key to high-performance substrates. Carbothermal reduction is the most mature commercial method, producing powder with high sphericity and purity. Hydrolysis resistance is critical—surface modification (e.g., nano-coating) addresses this. Customers asking which high-purity AlN powder manufacturer is the best prioritize hydrolysis resistance and batch consistency.

II. AlN Ceramic Sintering

Sintering aids (e.g., Y₂O₃) enable liquid-phase sintering and oxygen removal, boosting thermal conductivity. Pressureless sintering is standard for AlN substrates; advanced processes like SPS or HIP serve higher-performance needs.

III. Product Types

- AlN heat dissipation substrates: For IGBT/LED thermal management; processable into AlN direct bonded copper substrates

- AlN ceramic rods: Cylindrical structural components

- AlN ceramic microspheres: Thermal fillers, grinding media, or granulated raw materials for dry-pressed substrates

- Complex shapes via AlN ceramic machining

Engineers often compare AlN vs. silicon nitride for specific thermal and mechanical requirements.

IV. Market

Xiamen Juci has localized AlN ceramic substrates and high-purity AlN powder production. China's 2023 AlN market reached ~1.56 billion RMB, with global growth from $169M (2025) to $258.8M (2032), showing strong domestic substitution potential.

Xiamen Juci specializes in the R&D, production, and sales of AlN powder and AlN ceramic structural components, possessing mature production technologies and a comprehensive service system with reliable quality and stable supply. For those in need of AlN powder and related products, please feel free to contact us at any time, and we will provide you with professional solutions.

Contact: Jenny Qin / 진현혜

Xiamen Juci Technology Co., Ltd.

Phone: +86 151-5177-8700

Email: qinxianhui@chinajuci.com

Website: www.jucialnglobal.com

The stable operation of AI large models, computing servers, and 800V fast-charging platforms all relies on an unseen yet "hardcore necessity" — high-purity AlN powder. Without it, chips would overheat, high-speed signals would distort, and high-voltage equipment would fail.

Since 2026, a global supply chain crisis has emerged: Japanese leaders have reduced production, lead times have tripled, and prices have surged by 50–100%. This crisis stems not from insurmountable technical barriers, but from a long-standing overseas monopoly. It also marks the golden inflection point where domestic aluminum nitride raw materials shift from a "plan B" to an "essential necessity."

I. Why is aluminum nitride performance so critical?

Ultimately, all high-performance ceramic substrates and semiconductor components compete on aluminum nitride performance and raw material quality. High-purity aluminum nitride powder serves as the core raw material for manufacturing substrates used in 1.6T optical modules, AI server power supplies, and third-generation semiconductor power devices. It is also the starting point for key aluminum nitride applications such as thermally conductive fillers and high-heat-dissipation packaging materials.

Compared with traditional alumina, high-purity aluminum nitride offers 5–7 times higher thermal conductivity and 30 times that of ordinary PCBs — a clear and decisive advantage.

II. What are the key aluminum nitride applications?

Typical aluminum nitride applications include high-thermal-conductivity ceramic substrates, electrostatic chucks, thermal gels, thermal pads, thermal greases, and more — widely used in advanced fields such as semiconductor packaging, new energy vehicles, and 5G communications.

III. How to select aluminum nitride suppliers and aluminum nitride manufacturers?

As domestic substitution accelerates, aluminum nitride suppliers and manufacturers with stable mass production capabilities are becoming the core forces of the industry chain. When selecting a partner, key factors to consider include: powder purity, particle size distribution, sintering activity, and batch-to-batch consistency.

Today, leading domestic aluminum nitride manufacturers have achieved an annual production capacity of thousands of tons of high-purity AlN powder, securing an important position in the ongoing global supply chain restructuring.

Contact: Jenny Qin / 진현혜 

Xiamen Juci Technology Co., Ltd.

Phone: +86 151-5177-8700

Email: qinxianhui@chinajuci.com

Website: www.jucialnglobal.com

I. The 1.6T Era Begins: AlN Substrates Emerge as the Critical Bottleneck

With 2026 marking the first year of mass commercialization for 1.6T high-speed optical modules, the global computing power supply chain is undergoing rapid iteration. Market projections for 1.6T module demand have been sharply revised upward from initial estimates of tens of millions of units, reflecting astonishing year-on-year growth.

However, a severe capacity bottleneck has surfaced. Each 1.6T optical module typically requires 2–3 high-end AlN substrates, a requirement alone consuming a massive portion of the global high-end production capacity. As the heat flux density of 1.6T modules triples compared to the previous generation, conventional substrates are no longer viable. This cements AlN ceramic substrates—boasting thermal conductivity of 170–230 W/m·K and a Coefficient of Thermal Expansion (CTE) closely matching semiconductors—as an indispensable necessity.

II. Supply-Demand Imbalance Intensifies, Testing Supply Chain Resilience

The global high-end AlN substrate market is facing a stark supply deficit. Industry forecasts project total demand to exceed 100 million units in 2026, while effective supply struggles to close the gap, leaving a significant and widening shortfall.

Compounding this, supply-side uncertainties persist. Leading Japanese manufacturers have tightened allocation quotas, and coupled with upstream raw material volatility, prices for high-end substrates have surged while delivery lead times have stretched from a standard 8 weeks to several months. Against this backdrop, high-purity aluminum nitride powder suppliers have become strategically vital. Domestic leaders have achieved breakthroughs in the high-purity aluminum nitride market, developing proprietary powders whose purity meets world-class standards, thereby laying a solid material foundation for the domestic substrate industry.

III. Domestic Champions Rise, Unlocking Full Industry Chain Synergy

Constrained overseas supply is accelerating domestic substitution. Leading Chinese AlN substrate manufacturers are operating at full capacity with high utilization rates, aggressively expanding output to meet urgent downstream demand. Several domestic frontrunners have successfully penetrated the supply chains of top-tier global optical module makers and AI computing giants.

This momentum is resonating across the entire value chain. Beyond substrates, aluminum nitride filler factories and thermal management ceramic fillers are witnessing explosive demand, becoming critical materials for AI server cooling solutions. Concurrently, aluminum nitride crucible and aluminum nitride rod suppliers are also reaping the benefits of industry-wide expansion. Driven by global powder shortages and constrained supply from major overseas players, aluminum nitride powder prices remain firm, further cementing the cost and delivery advantages of the domestic supply chain 

IV. Outlook: A Sustained Upswing

Looking ahead, the dual engines of AI and high-speed optical modules will continue to propel AlN demand higher through 2027. The long-standing overseas monopoly is rapidly unraveling. The 2026–2027 period represents a pivotal window for domestic high-end AlN players to capture market share and realize substantial performance growth.

Xiamen Juci manufactures Aluminum Nitride ceramic substrates, Aluminum Nitride powder, and related products. Please contact us if you have any requirements.

Contact: Jenny Qin / 진현혜 

Phone: +86 151-5177-8700

Wechat ID: JENNY-8866

Xiamen Juci Technology Co., Ltd.

Email: qinxianhui@chinajuci.com

Website: www.jucialnglobal.com

Against the backdrop of deepening structural shifts across the global semiconductor and new energy landscapes, the high-end aluminum nitride (AlN) powder market is entering a period of unprecedented transformation. For procurement decision-makers seeking a competitive edge, this moment represents far more than a supply chain contingency—it is a strategic opportunity to reshape cost structures and sharpen market responsiveness.

I. Widening Supply–Demand Imbalances Elevate Supply Chain Security

Overseas capacity adjustments and geopolitical frictions are placing sustained pressure on the stability of high-purity AlN supply. At the same time, demand for AlN Filler for new energy vehicle​ applications is accelerating sharply, while the extreme thermal management requirements of AI computing chips and high-speed optical modules continue to drive a clear “volume-plus-price” uptrend across the market.

The reality is increasingly visible: extended lead times and rising procurement costs. Whether serving as a general-purpose Aluminum Nitride Thermal Filler​ or functioning as an AlN thermal conductive filler​ in precision assemblies, a stable raw material supply has overtaken absolute price as the primary criterion in procurement decisions.

II. The Rise of Domestic Capabilities: From Passive Alternative to Active Preference

In this context, the strategic value of domestic supply chains is being meaningfully redefined. Leading Chinese manufacturers such as Xiamen Juci have leveraged continuous technological iteration to match the core performance benchmarks of top-tier international suppliers.

This is particularly evident in Aluminum nitride ceramic for optical modules, where ultra-high purity is non-negotiable, as well as in the use of aluminum nitride (AlN) gap filler​ to enhance the reliability of power modules. Here, Xiamen Juci has not only overcome long-standing technical barriers but also delivers solutions that blend high performance with strong cost competitiveness, backed by responsive local services. This evolution—from “usable” to “industry-grade”—signals that domestic substitution has entered a decisive, deep-water phase.

III. A New Procurement Paradigm: Lock in Core Suppliers to Gain First-Mover Advantage

Confronted with heightened market volatility, building a diversified and resilient supply system has become a broad consensus across the industry. Now is the optimal window to formally incorporate proven Chinese aluminum nitride powder.

Contact:  Jenny Qin / 진현혜 

Phone: +86 151-5177-8700

Wechat ID: JENNY-8866

Xiamen Juci Technology Co., Ltd.

Email: qinxianhui@chinajuci.com

Website: www.jucialnglobal.com 

For any formulator, a powerful silicone defoamer, while effectively suppressing foam, can result in numerous fisheyes in the coating film—a true professional nightmare. This is the crux of the problem: defoamers are effective precisely because of their low surface tension and incompatibility, which directly threaten the transparency, gloss, and smoothness of the final coating. You're not just adding an additive; you're adding a potential contaminant that must perform a specific, intense task and then disappear completely. The key to finding this balance lies not in brute force, but in achieving perfect, temporary incompatibility.

The root of the problem is residue. Highly effective but poorly matched defoamer droplets don't always completely blend or escape. They remain on the coating, creating weak points that manifest as pits, haze, or orange peel texture. In inks, this can cause pinholes or affect color intensity; in clear coatings, it can cause unacceptable cloudiness. Therefore, our goal is not the most powerful defoamer on the market, but the smartest defoamer—a self-regulating defoamer that can precisely adjust to the dynamic characteristics of a specific system.

This solution shifts the focus from pure efficiency to refined compatibility. This means moving beyond generic options and seeking a compatibility-focused defoamer. The evaluation process must consider the resin's chemical class (waterborne acrylic resins, solvent-based polyurethane resins), the system's polarity, the curing mechanism, and all other additives in the mixture. The objective is to find a product with sufficient surface activity to disrupt the foam layer during mixing and application, but whose carrier and active ingredient are designed to fully emulsify or diffuse within the cured film without causing defects.

Achieving this requires a strategic two-stage approach. First, rigorous compatibility testing is conducted to simulate real-world application conditions: don't just stir and observe for foam breakage; first, dilute and cure the formulation, examining surface defects under oblique light. Second, the timing of the defoamer's action is considered. Sometimes, a targeted defoamer that controls foam during high-shear production but deactivates before film formation is superior to a continuously effective defoamer. The best option often lies in custom blends or modified silicone oils to achieve controlled incompatibility.

Ultimately, solving the formulator's dilemma means transforming defoamers from a necessary nuisance into a precision component. This requires accepting the fact that defoamers that perform best in beaker tests often perform worst in the final application. By prioritizing long-term film integrity over short-term defoaming and selecting a precision defoamer designed for a specific chemical composition, you can transform a long-standing problem into a controllable variable, ensuring smooth production and a flawless final product.

Ketone resin

, also known as polyketone resin, ketone resin or ketone-aldehyde resin, is a condensation product of cyclohexanone and formaldehyde containing carbonyl and hydroxyl groups.



It can be used for many industries. Hereby pls check some usages as follows;



Ink

In printing inks such as laminated inks, gravure inks, surface printing inks, flexographic inks, security inks, and ballpoint pen inks, adding ketone resins (2-15% in ink formulations) can improve the wettability, shine, adhesion, printability, solid content, and drying time of pigments.



Ketone resin can solve the problem of poor adhesion of substrates such as PE, PP, PET and PVC, and can also improve the fluidity and adhesion of ball point pen ink. It can also be used in food packaging ink.



Paint and Coating

Ketone resins can be used as co-adhesives for paints, varnishes, printing inks and other inks. Not only do they increase solids content and speed up drying, but they also improve many properties such as hardness, shine and film formation. Increased adhesion on various substrates, coupled with its resistance to hydrolysis, enhances anti-corrosion properties.



In coating formulations, ketone resins can give products high hardness, gloss and flexibility. At the same time can reduce viscosity, reduce pitting corrosion, improve adhesion, leveling and solid content. Suitable for the production of hammer paint, nitrocellurocellulocular paint, such as mechanical paint, wood paint and transparent stable color paint.



Adhesive

It is ideal for making nitrocellulose adhesives that can be used for leather, paper and other similar materials